nach oben

Physics of Metals and Metallography

Erschienen in:

29.12.2023 | STRENGTH AND PLASTICITY

Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys

verfasst von: Sezen Aksöz, Fadimana Öcal, Pınar Ata Esener, Esra Öztürk, Necmettin Maraşlı

Erschienen in: Physics of Metals and Metallography | Ausgabe 13/2023

Einloggen

Aktivieren Sie unsere intelligente Suche, um passende Fachinhalte oder Patente zu finden.

search-config

KI-gestützte Suche

Aus

Abstract

In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn–1 wt % Ag–0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.

Vorheriger Artikel Research Progress on Prediction Models of Plastic Deformation and Ductile Fracture of Titanium Alloy

Nächster Artikel Microstructure and Properties of Cu–Ti Alloys Prepared by Aluminothermic Reaction and Subsequent Rolling

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 340 Zeitschriften

aus folgenden Fachgebieten:

Bauwesen + Immobilien
Business IT + Informatik
Finance + Banking
Management + Führung
Marketing + Vertrieb
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Jetzt informieren

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

Jetzt informieren

D. A.-A. Shnawah, S. B. M. Said, M. F. M. Sabri, I. A. Badruddin, and F. X. Che, “Microstructure, mechanical, and thermal properties of the Sn–1Ag–0.5Cu solder alloy bearing Fe for electronics applications,” Mater. Sci. Eng., A 551, 160–168 (2012). https://doi.org/10.1016/j.msea.2012.04.115CrossRef

A. Z. Miric and A. Grusd, “Lead-free alloys,” Solder. Surf. Mt. Technol. 10, 19–25 (1998). https://doi.org/10.1108/09540919810203793CrossRef

I. Anderson, J. Walleser, and J. L. Harringa, “Observations of nucleation catalysis effects during solidification of SnAgCuX solder joints,” JOM 59 (7), 38–43 (2007). https://doi.org/10.1007/s11837-007-0087-3CrossRef

M. Huang, C. M. L. Wu, J. K. L. Lai, and Y. C. Chan, “Developing a lead-free solder alloy Sn–Bi–Ag–Cu by mechanical alloying,” J. Electron. Mater. 29, 1021–1026 (2000). https://doi.org/10.1007/s11664-000-0166-5ADSCrossRef

B. Zhang, H. Ding, and X. Sheng, “Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact,” Microelectron. Reliab. 49, 530–536 (2009). https://doi.org/10.1016/j.microrel.2009.02.024CrossRef

D. Shnawah, M. F. M. Sabri, and I. A. Badruddin, “A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products,” Microelectron. Reliab. 52, 90–99 (2012). https://doi.org/10.1016/j.microrel.2011.07.093CrossRef

M. Abtew and G. Selvaduray, “Lead-free solders in microelectronics,” Mater. Sci. Eng., R: Rep. 27, 95–141 (2000). https://doi.org/10.1016/s0927-796x(00)00010-3CrossRef

I. E. Anderson, J. C. Foley, B. A. Cook, J. Harringa, R. L. Terpstra, and O. Unal, “Alloying effects in near-eutectic Sn–Ag–Cu solder alloys for improved microstructural stability,” J. Electron. Mater. 30, 1050–1059 (2001). https://doi.org/10.1007/s11664-001-0129-5ADSCrossRef

D. Y. R. Chong, F. X. Che, J. H. L. Pang, K. Ng, J. Y. N. Tan, and P. T. H. Low, “Drop impact reliability testing for lead-free and lead-based soldered IC packages,” Microelectron. Reliab. 46, 1160–1171 (2006). https://doi.org/10.1016/j.microrel.2005.10.011CrossRef

10.

A. Yu, J.-W. Jang, J.-K. Kim, J.-H. Lee, and M.-S. Kim, “Improved reliability of Sn–Ag–Cu–In solder alloy by the addition of minor elements,” in Proc. 60th Electronic Components and Technology Conf. (ECTC), Las Vegas, 2010 (IEEE, 2010), pp. 1524–1528. https://doi.org/10.1109/ectc.2010.5490792

11.

L. I. Kaigorodova, D. Yu. Rasposienko, V. G. Pushin, and V. P. Pilyugin, “Structural and phase transformations in Al–Li–Cu–Mg–Zr–Sc–Zn alloy upon storage after megaplastic deformation,” Phys. Met. Metallogr. 120, 1200–1206 (2019). https://doi.org/10.1134/s0031918x1912007xADSCrossRef

12.

D. Suh, D. W. Kim, P. P. Liu, H. Kim, J. A. Weninger, C. M. Kumar, A. Prasad, B. W. Grimsley, and H. B. Tejada, “Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions,” Mater. Sci. Eng., A 460–461, 595–603 (2007). https://doi.org/10.1016/j.msea.2007.01.145CrossRef

13.

W. Kittidacha, A. Kanjanavikat, and K. Vattananiyom, “Effect of SAC alloy composition on drop and temp cycle reliability of BGA with NiAu pad finish,” in 2008 10th Electronics Packaging Technology Conf. (IEEE, 2008). https://doi.org/10.1109/eptc.2008.4763572

14.

K. Maslinda, A. S. Anasyida, and M. S. Nurulakmal, “Effect of Al addition to bulk microstructure, IMC formation, wetting and mechanical properties of low-Ag SAC solder,” J. Mater. Sci.: Mater. Electron. 27, 489–502 (2016). https://doi.org/10.1007/s10854-015-3780-yCrossRef

15.

Ye. S. Touloukian, R. W. Powell, C. Y. Ho, and P. G. Klemens, Thermal Conductivity: Metallic Elements and Alloy (Springer, 1970).CrossRef

16.

B. L. Chen and G. Y. Li, “An investigation of effects of Sb on the intermetallic formation in Sn–3.5Ag–0.7Cu solder joints,” IEEE Trans. Components Packaging Technol. 28, 534–541 (2005). https://doi.org/10.1109/tcapt.2005.848573CrossRef

17.

S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong, and W. K. C. Yung, “Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy,” J. Alloys Compd. 481, 167–172 (2009). https://doi.org/10.1016/j.jallcom.2009.03.017CrossRef

18.

M. Gündüz and J. D. Hunt, “The measurement of solid-liquid surface energies in the Al–Cu, Al–Si and Pb–Sn systems,” Acta Metall. 33, 1651–1672 (1985). https://doi.org/10.1016/0001-6160(85)90161-0CrossRef

19.

M. Demir, S. Aksöz, E. Öztürk, and N. Maraşlı, “The measurement of thermal conductivity variation with temperature for Sn-based lead-free binary solders,” Metall. Mater. Trans. B 45, 1739–1749 (2014). https://doi.org/10.1007/s11663-014-0109-9CrossRef

20.

L. Valder, “Resistivity measurements on germanium for transistors,” Proc. IRE 42, 420–427 (1954). https://doi.org/10.1109/jrproc.1954.274680

21.

W. D. Callister and D. G. Rethwisch, Fundamentals of Materials Science and Engineering: An Integrated Approach, 8th ed. (John Wiley & Sons, 2008).

22.

S. Jayesh and E. Jacob, “An experimental investigation on the properties of two novel ternary solder alloys Sn–0.5Cu–3Bi and Sn–1Cu–1Ni replacing lead,” Phys. Met. Metallogr. 120, 1398–1403 (2019). https://doi.org/10.1134/s0031918x1913009xADSCrossRef

23.

G. Ren and M. N. Collins, “The effects of antimony additions on microstructures, thermal and mechanical properties of Sn–8Zn–3Bi alloys,” Mater. Des. 119, 133–140 (2017). https://doi.org/10.1016/j.matdes.2017.01.061CrossRef

24.

X. Ren, Yu. Huang, and Yu. Liu, “Effect of Zr addition on microstructure and properties of Al–Sn–Cu based alloy,” Phys. Met. Metallogr. 120, 694–701 (2019). https://doi.org/10.1134/S0031918X19070093ADSCrossRef

25.

L. Zhang, S. Xue, L. Gao, Z. Sheng, H. Ye, Z. Xiao, G. Zeng, Ya. Chen, and Sh. Yu, “Development of Sn–Zn lead-free solders bearing alloying elements,” J. Mater. Sci.: Mater. Electron. 21, 1–15 (2010). https://doi.org/10.1007/s10854-009-0014-1CrossRef

26.

M. Rettenmayr, P. Lambracht, B. Kempf, and M. Graff, “High melting Pb-free solder alloys for die-attach applications,” Adv. Eng. Mater. 7, 965–969 (2005). https://doi.org/10.1002/adem.200500124CrossRef

27.

K. Suganuma, S. Kim, and K. Kim, “High-temperature lead-free solders: Properties and possibilities,” JOM 61, 64–71 (2009). https://doi.org/10.1007/s11837-009-0013-yCrossRef

28.

R. E. Smallman and R. J. Bishop, “Structural phases: Their formation and transitions,” in Modern Physical Metallurgy and Materials Engineering: Science, Process, Applications, 6th ed. (Butterworth-Heinemann, 1999), pp. 42–83. https://doi.org/10.1016/b978-075064564-5/50003-3

29.

S.-W. Chen, Ch.-Ch. Chen, W. Gierlotka, A.-R. Zi, P.‑Yi. Chen, and Hs.-J. Wu, “Phase equilibria of the Sn–Sb binary system,” J. Electron. Mater. 37, 992–1002 (2008). https://doi.org/10.1007/s11664-008-0464-xADSCrossRef

30.

J. K. Chen, H. Y. Hung, C. F. Wang, and N. K. Tang, “Thermal and electrical conductivity in Al–Si/Cu/Fe/Mg binary and ternary Al alloys,” J. Mater. Sci. 50, 5630–5639 (2015). https://doi.org/10.1007/s10853-015-9115-9ADSCrossRef

31.

A. K. Gain, Y. C. Chan, and W. K. C. Yung, “Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt % nano-TiO₂ composite solder on flexible ball grid array substrates,” Microelectron. Reliab. 51, 975–984 (2011). https://doi.org/10.1016/j.microrel.2011.01.006CrossRef

Titel: Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn–Ag–Cu High-Temperature Solder Alloys
verfasst von: Sezen Aksöz
Fadimana Öcal
Pınar Ata Esener
Esra Öztürk
Necmettin Maraşlı
Publikationsdatum: 29.12.2023
Verlag: Pleiades Publishing
Erschienen in: Physics of Metals and Metallography / Ausgabe 13/2023
Print ISSN: 0031-918X
Elektronische ISSN: 1555-6190
DOI: https://doi.org/10.1134/S0031918X22601974

Springer Professional

Abstract

Bitte loggen Sie sich ein, um Zugang zu Ihrer Lizenz zu erhalten.

Sie haben noch keine Lizenz? Dann Informieren Sie sich jetzt über unsere Produkte:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Wirtschaft"

Springer Professional "Technik"

Weitere Artikel der Ausgabe 13/2023

Microstructure and Properties of Cu–Ti Alloys Prepared by Aluminothermic Reaction and Subsequent Rolling

Precipitation Behavior of Primary Carbide in H13 Bloom Die Steel

Effect of Mg Content Change on the Production of Closed-Cell Aluminum Alloy Foam by Selective Laser Melting

Investigation of the Effects of Sandblasting, Acid Etching, and Anodizing Parameters in the SLA + Anodizing on the Surface Treatment of Titanium Dental Implant Fixtures

Study on the Micro-Texture and Anisotropy of a Cold-Rolled and Intercritically Annealed DP800 Steel

Study on Nucleation and Growth of Columnar Grains in Non-Oriented Steel by Phase Transformation