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2023 | OriginalPaper | Buchkapitel

The Technology and Applications of RIE and DRIE Processes

verfasst von : Jiangpeng Li

Erschienen in: Proceedings of the 6th International Conference on Economic Management and Green Development

Verlag: Springer Nature Singapore

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Abstract

The research progress of etching technology is closely related to modern processing technology and is inseparable from people’s lives. In recent decades, with economic development and social progress, especially the increasing demand in the semiconductor industry, etching has become more and more widely used, and etching technology has almost reached unprecedented development. This article starts from the angle of principle, process and influencing factors, and introduces two etching methods, RIE and DRIE. Two applications are listed, namely black silicon preparation and a device in MEMS fabrications. The study found that compared with other etching technologies, these two technologies have advantages such as reducing loss and improving yield respectively. However, as the size of the substrate continues to increase and the size of the device structure continues to shrink, high etching speed and high uniformity will become the key direction of the development of microfabrication technology, and the improvement of process and technology will inevitably become a future issue.

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Literatur
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Metadaten
Titel
The Technology and Applications of RIE and DRIE Processes
verfasst von
Jiangpeng Li
Copyright-Jahr
2023
Verlag
Springer Nature Singapore
DOI
https://doi.org/10.1007/978-981-19-7826-5_125

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