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01.11.2023 | ELECTRICAL AND MAGNETIC PROPERTIES

Thermal Contact Resistance of the Copper–Copper Pair with Graphene Thermal Interface in Magnetic Fields up to 10 T

verfasst von: K. A. Kolesov, A. V. Mashirov, A. V. Irzhak, M. V. Chichkov, E. F. Safrutina, D. A. Kiselev, A. S. Kuznetsov, O. V. Belova, V. V. Koledov, V. G. Shavrov

Erschienen in: Physics of Metals and Metallography | Ausgabe 11/2023

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Abstract

We investigate thermal contact resistance of a detachable connection in the copper–copper contact pair with a thermal interface made of graphene layers synthesized by chemical vapor deposition onto the contacting surface. The values of the thermal contact resistance of a detachable copper–graphene–copper contact pair were obtained using the transient heat flow method in the temperature range of 15–150 K under the influence of an external magnetic field of up to 10 T.

Vorheriger Artikel Magnetization and Magnetostriction of LaFe11.2 – хMnxCo0.7Si1.1 Alloys (x = 0.1, 0.2, 0.3) in Pulsed Magnetic Fields

Nächster Artikel Magnetocaloric Effect and Phase Separation: Theory and Prospects

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Titel: Thermal Contact Resistance of the Copper–Copper Pair with Graphene Thermal Interface in Magnetic Fields up to 10 T
verfasst von: K. A. Kolesov
A. V. Mashirov
A. V. Irzhak
M. V. Chichkov
E. F. Safrutina
D. A. Kiselev
A. S. Kuznetsov
O. V. Belova
V. V. Koledov
V. G. Shavrov
Publikationsdatum: 01.11.2023
Verlag: Pleiades Publishing
Erschienen in: Physics of Metals and Metallography / Ausgabe 11/2023
Print ISSN: 0031-918X
Elektronische ISSN: 1555-6190
DOI: https://doi.org/10.1134/S0031918X23601798

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